Delivers energy effective dual-core handling in a ruggedized case program for a varied variety of included applications
VIA Technological innovation, Inc, a major head of energy effective handling systems, today declared the VIA AMOS-3002, an ultra compact, fanless program developed around the tiny VIA EPIA-P900 Pico-ITX panel. The VIA AMOS-3002 provides included customers with a program that provides all the additional features and electronic press requirements required for a varied variety of included programs such as telematics, in-vehicle control, device to device operator (M2M), electronic signs and kiosks.
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